DocumentCode :
1947185
Title :
Phase change in microchannel heat sink under forced convection boiling
Author :
Jiang, Linan ; Wong, Man ; Zohar, Yitshak
Author_Institution :
Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., China
fYear :
2000
fDate :
23-27 Jan 2000
Firstpage :
397
Lastpage :
402
Abstract :
A microchannel heat sink system, consisting of parallel microchannels, distributed temperature micro-sensors and a local heater, has been fabricated and characterized. V-grooves with hydraulic diameter of either 40 μm or 80 μm were formed by bulk silicon etching. The heater and temperature microsensor array were fabricated using surface micromachining. Microchannels were realized by bonding a glass wafer to the silicon substrate, resulting in a transparent cover for flow visualization. Phase change during the boiling process was studied under forced convection conditions, where DI water was used as the working fluid. No boiling plateau, associated with latent heat, has been observed in the boiling curves of microchannel heat sinks. Flow visualization was carried out to understand the boiling mechanism in such a system. Three phase-change modes were observed depending on the input power level. Local nucleation boiling within the microchannels occurred at low power level. At moderate levels, large bubbles developed at the inlet/outlet regions, and the upstream bubbles were forced through the channels and out of the system. At higher input power levels, a stable annular flow mode was observed, where a thin liquid film coated each channel wall until critical heat flux conditions developed with a dryout of the system
Keywords :
boiling; channel flow; distributed sensors; forced convection; heat sinks; micromachining; microsensors; temperature sensors; two-phase flow; DI water; MEMS device; V-groove; bulk silicon etching; distributed temperature microsensor array; flow visualization; forced convection boiling; latent heat; liquid-vapour phase transformation; local heater; microchannel heat sink; surface micromachining; wafer bonding; Etching; Heat sinks; Hydraulic diameter; Microchannel; Micromachining; Microsensors; Silicon; Temperature; Visualization; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on
Conference_Location :
Miyazaki
ISSN :
1084-6999
Print_ISBN :
0-7803-5273-4
Type :
conf
DOI :
10.1109/MEMSYS.2000.838550
Filename :
838550
Link To Document :
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