Title :
A low temperature biochemically compatible bonding technique using fluoropolymers for biochemical microfluidic systems
Author :
Han, Arum ; Oh, Kwang W. ; Bhansali, Shekhar ; Henderson, H.Thurman ; Ahn, Chong H.
Author_Institution :
Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
Abstract :
A new low temperature biochemically compatible bonding technique using fluoropolymers has been developed in this work and characterized in terms of mechanical bonding strength and biochemical resistance. This bonding technique uses a spin-on Teflon-like amorphous fluorocarbon polymer (CYTOPTM) as a bonding interface layer. The developed bonding process requires a bonding temperature of 160°C and the bonding strength attained from the process shows 4.3 Mpa in silicon-to-silicon. Furthermore, the bonding technique achieves reliable and leak-proof bonding in various substrates and provides excellent chemical resistance and biocompatibility for some specific immunoassays. The bonding technique developed in this work has been successfully applied to the development of a microfluidic motherboard system with surface mountable microfluidic components
Keywords :
biochemistry; biological techniques; low-temperature techniques; microfluidics; polymer films; wafer bonding; 160 C; CYTOP interface layer; MEMS device; Si-Si; biochemical microfluidic system; biochemical resistance; immunoassay; low temperature bonding technique; mechanical bonding strength; silicon substrate; spin-on amorphous fluorocarbon polymer; Assembly systems; Biological materials; Etching; Glass; Microfluidics; Packaging; Plasma temperature; Polymers; Temperature sensors; Wafer bonding;
Conference_Titel :
Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on
Conference_Location :
Miyazaki
Print_ISBN :
0-7803-5273-4
DOI :
10.1109/MEMSYS.2000.838553
