A low temperature biochemically compatible bonding technique using fluoropolymers for biochemical microfluidic systems

Author

Han, Arum ; Oh, Kwang W. ; Bhansali, Shekhar ; Henderson, H.Thurman ; Ahn, Chong H.

Author_Institution

Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA

fYear

2000

fDate

23-27 Jan 2000

Firstpage

414

Lastpage

418

Abstract

A new low temperature biochemically compatible bonding technique using fluoropolymers has been developed in this work and characterized in terms of mechanical bonding strength and biochemical resistance. This bonding technique uses a spin-on Teflon-like amorphous fluorocarbon polymer (CYTOP^TM) as a bonding interface layer. The developed bonding process requires a bonding temperature of 160°C and the bonding strength attained from the process shows 4.3 Mpa in silicon-to-silicon. Furthermore, the bonding technique achieves reliable and leak-proof bonding in various substrates and provides excellent chemical resistance and biocompatibility for some specific immunoassays. The bonding technique developed in this work has been successfully applied to the development of a microfluidic motherboard system with surface mountable microfluidic components

Keywords

biochemistry; biological techniques; low-temperature techniques; microfluidics; polymer films; wafer bonding; 160 C; CYTOP interface layer; MEMS device; Si-Si; biochemical microfluidic system; biochemical resistance; immunoassay; low temperature bonding technique; mechanical bonding strength; silicon substrate; spin-on amorphous fluorocarbon polymer; Assembly systems; Biological materials; Etching; Glass; Microfluidics; Packaging; Plasma temperature; Polymers; Temperature sensors; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on

Conference_Location

Miyazaki

ISSN

1084-6999

Print_ISBN

0-7803-5273-4

Type

conf

DOI

10.1109/MEMSYS.2000.838553

Filename

838553