Title :
Development and performance characterizations of a QFN/HMT package
Author :
Lai, Yi-Shao ; Chang-Chien, Pao-Huei ; Chang, Chi-Wen ; Tsai, Tsung-Yueh ; Hung, Sung-Ching ; Tseng, Andy ; Takai, Keiji ; Hirashima, Tetsuyuki
Author_Institution :
Adv. Semicond. Eng., Inc., Kaohsiung
Abstract :
In this paper, application advantages, development, and fabrication process of aQFN/HMT is introduced. Identical functions are intentionally designed in both CSP- BGA and aQFN/HMT packaging structures so that thermal and electrical performances of these two structures can be reasonably compared and demonstrated. Our calculations indicate that thermal and electrical performances of aQFN/HMT are much better than CSP-BGA, when the same functions are designed in.
Keywords :
integrated circuit manufacture; integrated circuit packaging; thermal management (packaging); BGA-type CSP comparison; aQFN-HMT fabrication process; aQFN-HMT package performance characterization; advanced quad flat no-lead package; hybrid manufacturing technologies; package electrical performance; package thermal performance; Chip scale packaging; Costs; Electronic packaging thermal management; Electronics packaging; Etching; Fabrication; Lead; Semiconductor device packaging; Thermomechanical processes; Wafer scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2008.4550092
