DocumentCode :
1947602
Title :
Fault test structures for studying circuit performance
Author :
Mitchell, M.A. ; Nguyen, T.
Author_Institution :
Solid State Electron. Center, Honeywell Inc., Plymouth, MN, USA
fYear :
1994
fDate :
22-25 Mar 1994
Firstpage :
94
Lastpage :
97
Abstract :
Testing of ASICs is usually limited to “stuck-at” fault testing, and the consequences of incomplete electrical test fault coverage and latent defects that become activated during the stress of normal operation is a major concern. Usually, for the sake of yield estimation, it is assumed that any defect detected electrically with a defect test structure leads to a circuit failure. However, there is a wide range of defects which cause performance degradation without causing failure. This paper discusses process-induced defects and the faults they cause in logic gates and focuses in more detail on bridging defects
Keywords :
application specific integrated circuits; failure analysis; integrated circuit testing; logic testing; ASICs; bridging defects; circuit failure; circuit performance; electrical test fault coverage; fault test structures; latent defects; logic gates; performance degradation; process-induced defects; yield estimation; Circuit faults; Circuit optimization; Circuit testing; Electronic equipment testing; Fault detection; Integrated circuit testing; Logic gates; Logic testing; Semiconductor device testing; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronic Test Structures, 1994. ICMTS 1994. Proceedings of the 1994 International Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-1757-2
Type :
conf
DOI :
10.1109/ICMTS.1994.303495
Filename :
303495
Link To Document :
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