Title :
Wafer level vacuum packaged de-coupled vertical gyroscope by a new fabrication process
Author :
Song, H. ; Oh, Y.S. ; Song, I.S. ; Kang, S.J. ; Choi, S.O. ; Kim, H.C. ; Ha, B.J. ; Baek, S.S. ; Song, C.M.
Author_Institution :
Microsyst. Lab. S&C Sector, Samsung Adv. Inst. of Technol., Suwon, South Korea
Abstract :
A highly reliable, wafer level vacuum packaged and de-coupled vertical microgyroscope was developed. The de-coupled gyroscope which had four driving springs and two sensing springs was designed and fabricated. A new fabrication process which could realize a high aspect ratio and use a thick single crystalline silicon as a structure layer, was proposed. The vacuum environment for operating a vibratory gyroscope was accomplished with vacuum packaging at wafer level. The vacuum level of ambient pressure was about 150 mtorr. The resolution of the gyroscope was 0.013°/sec/Hz1/2. The output nonlinearity was below 2% in ±100°/s full scale
Keywords :
etching; gyroscopes; micromachining; microsensors; packaging; semiconductor technology; silicon; vibrations; 150 mtorr; Si; decoupled vertical gyroscope; driving springs; fabrication process; high aspect ratio structure; microgyroscope; sensing springs; thick single crystalline Si layer; vacuum packaged gyroscope; vibratory gyroscope; wafer level gyroscope; Crystallization; Electrodes; Fabrication; Frequency; Gyroscopes; Packaging; Silicon; Springs; Vacuum technology; Wafer scale integration;
Conference_Titel :
Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on
Conference_Location :
Miyazaki
Print_ISBN :
0-7803-5273-4
DOI :
10.1109/MEMSYS.2000.838571
