Fabrication of sub-micron structures with high aspect ratio for MEMS using deep X-ray lithography

Author

Ueno, Hiroshi ; Nishi, Nobuyoshi ; Sugiyama, Susumu

Author_Institution

Fac. of Sci. & Eng., Ritsumeikan Univ., Kyoto, Japan

fYear

2000

fDate

23-27 Jan 2000

Firstpage

596

Lastpage

601

Abstract

In this paper, we present the fabrication of sub-micron structures with high aspect ratio for practical and high performance microelectromechanical systems (MEMS) using deep X-ray lithography. It is necessary for practical and high performance MEMS to be fabricated microstructures with sub-micron widths and gaps (lines and spaces). In order to fabricate the sub-micron microstructures, sub-micron deep X-ray lithography has been investigated. As a result, a sub-micron PMMA structure with 0.2 μm minimum width, 6 μm length and 17 μm height was fabricated by deep X-ray lithography using an X-ray mask with thick X-ray absorbers having sub-micron width

Keywords

LIGA; X-ray masks; micromachining; 0.2 micron; 17 micron; 6 micron; Fresnel diffraction influence; LIGA; PMMA structure; X-ray mask; deep X-ray lithography; high aspect ratio; high performance MEMS; resist forming; submicron structures fabrication; thick X-ray absorbers; Fabrication; Facsimile; Microactuators; Microelectromechanical systems; Micromechanical devices; Microsensors; Microstructure; Voltage; X-ray diffraction; X-ray lithography;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on

Conference_Location

Miyazaki

ISSN

1084-6999

Print_ISBN

0-7803-5273-4

Type

conf

DOI

10.1109/MEMSYS.2000.838585

Filename

838585