Title :
The viability of 25 Gb/s on-board signalling
Author :
Ritter, Mark B. ; Pepeljugoski, Petar ; Gu, Xiaoxiong ; Kwark, Young ; Kam, Dong ; Rimolo-Donadio, Renato ; Wu, Boping ; Baks, Christian ; John, Richard ; Shan, Lei ; Schuster, Christian
Author_Institution :
T.J. Watson Res. Center, IBM Corp., Yorktown Heights, NY
Abstract :
What package improvements are required for dense, high aggregate bandwidth buses running at data rates beyond 10 Gb/s per pin, and when might optical interconnects on the board be required? We present a study of distance and speed limits for electrical on-board module-to-module links with an eye to answering these questions. Detailed electrical link models have been validated with active, high-speed differential bus measurements utilizing a 16-channel link chip with programmable equalization and a per-channel data rate of up to 11 Gb/s. Electrical signalling limits were then determined by extrapolating our models to higher speeds, and these limits were compared to the results of work on on-board optical interconnects.
Keywords :
integrated optoelectronics; optical interconnections; signalling; electrical link models; electrical on-board module-to-module links; extrapolation; high-speed differential bus measurements; on-board electrical signalling; optical interconnects; programmable equalization; Bandwidth; Electric variables measurement; Hardware; Integrated circuit interconnections; Optical interconnections; Optical switches; Packaging; Predictive models; Semiconductor device measurement; Space technology;
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2008.4550116
