Analysis of copper treatments and the effects on signal propagation

As computer data rates increase into the 30 - 50 Gb/s range fundamental material challenges emerge that make it difficult to design a robust electrical interconnect between the transmitter and receiver. This paper discusses the effects of differing copper treatments and the effects these treatments have on signal propagation for a computer electrical interconnect. Two types of treatments have been studied: high profile copper (HPC) and low profile copper (LPC). Discussions on the physical surface geometry and elemental analyses of these copper types along with their signaling effects are discussed below.