Electrical modeling of wirebonds in stacked ICs using cylindrical conduction mode basis functions

This paper discusses an efficient method for simulation and modeling of three-dimensional (3-D) interconnections such as wire bonds and through-hole vias. The proposed method is based on the volume electric field integral equation (EFIE), and approximates current density distribution with cylindrical conduction mode basis functions (CMBF). The geometrical fitness and orthogonal property of the basis functions are found useful in capturing skin effect and current crowding in cylindrical conductors. The Analyses of wire bonds using the proposed method demonstrate various 3-D coupling issues including wire bending effect, vertical coupling, and ground wiring.