DocumentCode :
1948952
Title :
High power SiC solid state RF-modules
Author :
Irsigler, R. ; Baumgartner, R. ; Hergt, M. ; Hughes, T. ; Heid, O.
Author_Institution :
Corp. Technol., Siemens AG, Erlangen/Munich, Germany
fYear :
2011
fDate :
19-23 June 2011
Firstpage :
674
Lastpage :
678
Abstract :
Solid state amplifiers begin to replace traditional vacuum tube technology (e. g. Klystrons) in several accelerator applications [1]. They offer the perspective of lower cost, better reliability and reduced maintenance [2]. Due to their modular construction, power levels can be scaled easily to meet the target application requirements. The new direct drive concept [3] offers the benefit of simple triggering and the possibility to individually control phase and power in each cavity segment, which increases operation mode flexibility of the final particle accelerator. We present development results of compact high power solid state RF-modules based on novel SiC transistors. The SiC transistor layout and the packaging technology was optimized for high frequency operation and we already reported previously that SiC transistors can provide RF output power levels well above 1 kW per device at 150 MHz [4]. We now present our second generation of high power solid state RF modules based on normally-on SiC vertical JFETs with significantly increased power ratings in the range of 5 - 25 kW per module depending on supply voltage, input power and pulse duration. An 84 kW RF-source was built by power combining of 32 RF-modules running at relatively low voltage of 160 V.
Keywords :
amplifiers; junction gate field effect transistors; silicon compounds; vacuum tubes; SiC; SiC transistors; SiC vertical JFET; high power SiC solid state RF-modules; packaging technology; power 5 kW to 25 kW; power 84 kW; solid state amplifiers; vacuum tube technology; voltage 160 V; Lead; Logic gates; Silicon carbide; Solids; Switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Pulsed Power Conference (PPC), 2011 IEEE
Conference_Location :
Chicago, IL
ISSN :
2158-4915
Print_ISBN :
978-1-4577-0629-5
Type :
conf
DOI :
10.1109/PPC.2011.6191561
Filename :
6191561
Link To Document :
بازگشت