DocumentCode :
1949172
Title :
Stress measurement by X-Ray diffraction method for electrodeposited SnCu coating on alloy 42 substrate
Author :
Kato, Takahiko ; Akahoshi, Haruo ; Nakamura, Masato ; Hashimoto, Tomoaki ; Nishimura, Asao
Author_Institution :
Mater. Res. Lab., Hitachi
fYear :
2008
fDate :
27-30 May 2008
Firstpage :
1491
Lastpage :
1497
Abstract :
A stress measurement method using SnCu coating on an Alloy 42 substrate sample, which indicated non-linear sin2 Psi diagram for the coating under ordinary X-ray diffraction conditions was investigated. Diffraction profile versus 2thetas diagrams for peak indexes of (312), (501), (213), (600), (323), (541), and (631) obtained using an iso inclination method and a fixed Psi method using CuKalpha radiation showed clear peaks for some Psi angles. However, in other cases, the diagrams showed flat forms (no peaks). It was found that removing the Psi data with the flat forms from the diffraction profile versus 2thetas diagram gave a linear sin2Psi diagram for each index. Indexes with higher 2thetas degrees had a smaller confidence limit. The (631) peak with the highest 2thetas degree, which had no flat forms in the diffraction profile versus the 2thetas diagram, even with seventeen Psi data points, indicated a linear sin2thetas diagram and a confidence limit of less than plusmn2 MPa.
Keywords :
X-ray diffraction; copper alloys; electrodeposition; electrodeposits; internal stresses; phase diagrams; tin alloys; 2thetas diagrams; SnCu; X-ray diffraction; alloy substrate; electrodeposited coating; inclination method; nonlinear sin2 Psi diagram; stress; Coatings; Copper alloys; Electronic mail; Lead; Production engineering; Scanning electron microscopy; Stress measurement; Substrates; X-ray diffraction; X-ray scattering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2008.4550173
Filename :
4550173
Link To Document :
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