• DocumentCode
    1949190
  • Title

    Analysis and measurements of EM and substrate coupling effects in common RF integrated circuits

  • Author

    Amaya, Rony E. ; Popplewell, Peter H R ; Cloutier, Mark ; Plett, Calvin

  • Author_Institution
    Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
  • fYear
    2004
  • fDate
    3-6 Oct. 2004
  • Firstpage
    363
  • Lastpage
    366
  • Abstract
    An investigation of coupling between inductors and resonators fabricated in Si substrates is presented and the effects on RF systems and components is discussed. EM simulators (e.g., Agilent Momentum) provide accurate near field analysis of coupling in lossy and complex silicon substrates. Measurements verify theory and a novel experimental technique to measure inductor and resonator coupling makes use of injection-lockable bipolar oscillators. The experiment is fast, accurate, and unique in that no matching, probe de-embedding, or calibration is necessary as the ratio of two on-chip signals is measured to yield the results. As an example, accounting for inductor coupling in a 4.7 GHz LNA reduces the amplifier´s gain from 22 dB to 18 dB.
  • Keywords
    MMIC amplifiers; circuit simulation; coupled circuits; electromagnetic coupling; electromagnetic induction; integrated circuit modelling; integrated circuit testing; radiofrequency integrated circuits; resonators; thin film inductors; 18 dB; 22 dB; 4.7 GHz; Agilent Momentum simulators; EM coupling effects; EM simulators; LNA gain; RF integrated circuits; RF systems; Si; Si substrates; calibration; inductor resonator coupling; inductors; injection-lockable bipolar oscillators; lossy complex silicon substrates; near field analysis; on-chip signals ratio; probe de-embedding; resonators; substrate coupling effects; Analytical models; Circuit simulation; Coupling circuits; Inductors; Injection-locked oscillators; Integrated circuit measurements; Probes; Radio frequency; Radiofrequency integrated circuits; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2004. Proceedings of the IEEE 2004
  • Print_ISBN
    0-7803-8495-4
  • Type

    conf

  • DOI
    10.1109/CICC.2004.1358823
  • Filename
    1358823