• DocumentCode
    1949574
  • Title

    Feature model to product architectures: Applying MDE to Software Product Lines

  • Author

    Perovich, Daniel ; Rossel, Pedro O. ; Bastarrica, María Cecilia

  • Author_Institution
    CS Dept., Univ. de Chile, Santiago, Chile
  • fYear
    2009
  • fDate
    14-17 Sept. 2009
  • Firstpage
    201
  • Lastpage
    210
  • Abstract
    A Software Product Line (SPL) is a portfolio of products that targets a particular domain. Feature Models are generally used for modeling domain knowledge including variability within SPLs. The Product Line Architecture (PLA) defines the structure that all potential products in the SPL share. Designing a good PLA is challenging since different products may require different characteristics, and it is difficult to achieve an acceptable trade-off. In this paper we apply Model-Driven Engineering techniques for systematizing the Domain Engineering stage to enable the automation of the Application Engineering stage. We use features to modularize architectural decisions and we encode them as model transformations that render the fragment of the product architecture that addresses the features. Then, we make the rationale explicit, and we enhance evolvability and incrementality diminishing design complexity. Product implementation is derived by means of generators analogously. We show our approach by developing a Meshing Tool SPL.
  • Keywords
    object-oriented programming; software architecture; software packages; Meshing Tool SPL; application engineering; domain engineering; feature models; model driven engineering; product line architecture; software product line; Asset management; Automation; Computer architecture; Maintenance engineering; Model driven engineering; Portfolios; Production; Programmable logic arrays; Software systems; Systems engineering and theory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Software Architecture, 2009 & European Conference on Software Architecture. WICSA/ECSA 2009. Joint Working IEEE/IFIP Conference on
  • Conference_Location
    Cambridge
  • Print_ISBN
    978-1-4244-4984-2
  • Electronic_ISBN
    978-1-4244-5295-8
  • Type

    conf

  • DOI
    10.1109/WICSA.2009.5290806
  • Filename
    5290806