Title :
Laser sintering of Ag nanopaste film and its application to bond-pad formation
Author :
Niizeki, Tomotake ; Maekawa, Katsuhiro ; Mita, Mamoru ; Yamasaki, Kazuhiko ; Matsuba, Yorishige ; Terada, Nobuto ; Saito, Hiroshi
Author_Institution :
JST Innovation Satellite, Tsukuba
Abstract :
A novel coating technology by means of sintering the silver NanoPastereg by a laser beam has been proposed. The novelty lies in the use of a conventional NdYAG laser to metalize nanoparticles as an alternative to furnace sintering. Silver nanoparticles with 5 nm in average diameter dispersed in the the silver NanoPaste are successfully sintered on the Cu substrate by the proposed method. Laser sintering proceeds from the paste surface into the substrate, and the thickness of a peeling-free film is around 0.2 mum. Multi-step sintering by the repletion of spin coating and laser metallization enables us to make a thicker Ag pad of around 1 mum. No peeling of the laser-sintered Ag film from the substrate was observed. Its adhesive strength is higher than that of a furnace-sintered sample. The Ag film thus fabricated can be used as pads for wire bonding, being an alternative to electroplating.
Keywords :
adhesion; laser sintering; lead bonding; metallic thin films; metallisation; nanoparticles; nanotechnology; silver; spin coating; Ag; adhesive strength; bond-pad formation; laser metallization; laser sintering; nanoparticles; nanopaste film; peeling-free film; spin coating; wire bonding; Bonding; Coatings; Furnaces; Laser beams; Laser sintering; Metallization; Nanoparticles; Silver; Substrates; Surface emitting lasers;
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2008.4550216
