Title :
Notice of Retraction
Simulation studies of reactive distillation processes for synthesis of ethyl acetate
Author :
Zhixian Huang ; Hui Tian ; Ting Qiu ; Yanxiang Wu
Author_Institution :
Sch. of Chem. & Chem. Eng., Fuzhou Univ., Fuzhou, China
Abstract :
Notice of Retraction
After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.
We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.
The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.
Ethyl acetate (EtAc) is mainly used as solvent in paints and coatings industry, inks production and as industrial solvent in many other branches of industry. Esterification of acetic acid with ethanol may be performed to synthesize ethyl acetate. In this paper, a reactive distillation (RD) column with packing cation exchange resins as a catalyst is applied. Mathematical models of reactive distillation are based on the conventional distillation process with supplementary equations added to model the reactions present. Column simulations performed here using Aspen Plus show excellent agreement with experimental data for the EtAc system. A sensitive analysis was performed to determine the effects of key design and operating variables on column performance and, subsequently, an optimal column configuration was obtained.
Keywords :
catalysts; chemical engineering; distillation; distillation equipment; solvents (industrial); EtAc system; catalyst; chemical reaction; ethyl acetate synthesis; packing cation exchange resins; reactive distillation column; reactive distillation processes; solvent; Analytical models; Educational institutions; Ethanol; Mathematical model; Petroleum; Temperature sensors; esterification; ethyl acetate; reactive distillation; simulation;
Conference_Titel :
Computer Science and Information Technology (ICCSIT), 2010 3rd IEEE International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-5537-9
DOI :
10.1109/ICCSIT.2010.5564623