Ultra-small compact transfer molded package for power modules

DIP-IPMs are intelligent power modules that integrate power devices, drivers and protection circuits in a dual-in-line transfer-molded package. The new generation DIP-IPM package applies an "isolated thermal sheet" and a unique molding process. The thermal sheet is composed of a ceramic filler with high thermal conductivity and a thermosetting resin. This sheet is attached to the lead frame so as to not form any clearance, and the other side is exposed on the surface of the package. This technique contributes to the reduction of the thermal resistance to one third that of a conventional one, and a space savings of approximately 40% for the package.