Title :
Sandblaster low power DSP [parallel DSP arithmetic microarchitecture]
Author :
Glossner, John ; Chirca, Kai ; Schulte, Michael ; Wang, Haoran ; Nasimzada, Nasir ; Har, David ; Wang, Shenghong ; Hoane, A. Joseph, Jr. ; Nacer, Gary ; Moudgill, Mayan ; Vassiliadis, Stamatis
Author_Institution :
Sandbridge Technol. Inc., White Plains, NY, USA
Abstract :
General purpose processors have utilized complex and energy inefficient techniques to accelerate performance. In embedded DSP designs, power constraints have precluded general purpose microarchitectural techniques. Rather than minimize average execution time, embedded DSP processors require the worst case execution time to be minimized. Subsequently, very long instruction word (VLIW) processors have been employed, but architecturally visible side effects have imposed restrictions on parallelism due to interrupt and latency considerations - particularly if all loads must complete prior to servicing interrupts. In this paper, we present a low power multithreaded interlocked (transparent) microarchitecture capable of parallelizing non-associative DSP arithmetic. We describe specific memory and logic techniques for reducing power dissipation and discuss how multithreading enables low power optimization.
Keywords :
digital signal processing chips; embedded systems; interrupts; low-power electronics; multi-threading; parallel architectures; pipeline arithmetic; Sandblaster low power DSP; VLIW processors; embedded DSP; instruction caches; interrupt servicing; latency; low power optimization; multithreaded interlocked microarchitecture; multithreading; nonassociative DSP arithmetic; parallel DSP arithmetic microarchitecture; pipeline processing; power dissipation reduction; very long instruction word processors; worst case execution time minimization; Acceleration; Arithmetic; Delay; Digital signal processing; Logic; Microarchitecture; Multithreading; Power dissipation; Sandblasting; VLIW;
Conference_Titel :
Custom Integrated Circuits Conference, 2004. Proceedings of the IEEE 2004
Print_ISBN :
0-7803-8495-4
DOI :
10.1109/CICC.2004.1358889