Title :
Embedded capacitor technology: A real world example
Author :
Smith, Norm ; Fan, Jun ; Andresakis, John ; Fukawa, Yoshi ; Harvey, Mark ; Knighten, Jim
Abstract :
Embedding capacitive layers inside the printed circuit board (PCB) have demonstrated the ability to reduce the number of surface mount technology (SMT) chip decoupling capacitors on the PCB surface as well as greatly improve the performance of the power distribution system. Many systems today utilize this technology, but most public information is limited to data on test vehicles or emulators. This paper utilizes simulated as well as measured product data to compare the performance of the standard design to one using various types of embedded capacitor layers with a reduced number of SMT decoupling capacitors. A methodology is provided that can be utilized for other designs.
Keywords :
capacitors; printed circuits; surface mount technology; embedded capacitor technology; power distribution system; printed circuit board; surface mount technology chip decoupling capacitors; test vehicles; Capacitance; Capacitors; Circuit testing; Power distribution; Predictive models; Printed circuits; Resonance; Surface-mount technology; System testing; Vehicles;
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2008.4550244