DocumentCode :
1950475
Title :
Enhancement of light efficiency of LED using a novel high refractive encapsulant
Author :
Li, Hsun-Tien ; Hsu, Chia-Wen ; Chen, Kai-Chi
Author_Institution :
Ind. Technol. Res. Inst., Hsinchu
fYear :
2008
fDate :
27-30 May 2008
Firstpage :
1926
Lastpage :
1930
Abstract :
In this study, we conversed Bisbromomethyl-biphenyl and thiourea to a new biphenyl dithiol (BPDT) and used it as a co-curing agent. Its structure was confirmed by means of FT- IR, 1H-NMR, and MS spectra. We co-cured the conventional diglycidyl ether of Bisphenol A (DGEBA) epoxy resin with BPDT and aliphatic tetra-thiol (Pentaerythritol tetrakis(3- mercaptopropionate)) to get a colorless encapuslant (HRIL). After 80deg.C/2hour and 120deg.C/2hour curing process, the optical properties of the cured HRIL were measured. The refractive index was 1.64 which is the highest refractive index among the current existed LED encapsulant, and the transmittance of the cured HRIL was above 85% on the visible wavelength. Furthermore, the effect on light efficiency of LED was evaluated and found that the light efficiency of HRIL encapsulated LED was promoted 14%, compared with the conventional epoxy encapsulated LED. This result certainly reveals that the high refractive index encapslant can effectively enhance the light efficiency of LED. We also analyzed the thermal mechanical property and thermal stability of the cured HRIL which contained a hindered amine light stabilizer (HALS) by TMA and TGA. The Tg of the cured HRIL was 85.2deg.C and the thermal decomposed temperature was 327.7deg.C. After HOdeg.C/lOOOhour thermal aging test, the decrease of transmittance was less than 5% and the thermal resistant result unveils that the novel high refractive index encapsulant is suitable for high performance LED applications.
Keywords :
Fourier transform spectra; ageing; infrared spectra; light emitting diodes; nuclear magnetic resonance; organic compounds; refractive index; thermal analysis; thermal stability; 1H-NMR spectra; DGEBA epoxy resin; FT-IR spectra; LED; TGA; aliphatic tetra-thiol; biphenyl dithiol; bisbromomethyl-biphenyl; co-curing agent; colorless encapuslant; diglycidyl ether of Bisphenol A; epoxy encapsulated LED; hindered amine light stabilizer; light efficiency; novel high refractive encapsulant; pentaerythritol tetrakis(3- mercaptopropionate); refractive index; thermal aging; thermal stability; thiourea; visible wavelength; Curing; Epoxy resins; Light emitting diodes; Mechanical factors; Optical refraction; Optical variables control; Refractive index; Stability analysis; Thermal resistance; Wavelength measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2008.4550245
Filename :
4550245
Link To Document :
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