Title :
Photo imageable solder resist for semiconductor packages
Author :
Yoshino, Toshizumi ; Katagi, Hideyuki ; Sato, Kuniaki
Author_Institution :
Hitachi Chem. Co., Ltd., Ibaragiken
Abstract :
Photo imageable solder resist is used as insulating material. By using photo imageable solder resist, electro devices such as a semiconductor chip and a condenser are insulated to a wiring circuit and an electrode, when they are mounted on the surface of a printed wiring board.
Keywords :
electronics packaging; photoresists; solders; condenser; electrodevices; insulating material; photo imageable solder resist; printed wiring board; semiconductor chip; semiconductor packages; wiring circuit; Circuits; Electric resistance; Electronics packaging; History; Resistance heating; Resists; Semiconductor device packaging; Substrates; Thermal stresses; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2008.4550257
