Title :
Ceramic packaging reliability study of a 13.5 kV multichip thyristor
Author :
Vergne, B. ; Gauthier-Blum, C. ; Brommer, V. ; Scharnholz, S. ; Spahn, E. ; Welleman, A.
Author_Institution :
French-German Res. Inst. of St.-Louis (ISL), St. Louis, France
Abstract :
We present our work on the reliability of the new ceramic housing of our 13.5 kV multichip thyristor. First ceramic versions manifested terrible failure after only a few shots under a bias voltage of 10 kV and a peak current of 110 kA in the best case. This problem has been solved and the newer ceramic-housing version is now fully commercialized under the model number 5SPB36Z1350. This product version completes successfully a stress test of 200 shots under previous conditions without failing. Moreover, no aging behavior has been detected.
Keywords :
ceramic packaging; reliability; thyristors; ceramic housing; ceramic packaging reliability; current 110 kA; model number 5SPB36Z1350; multichip thyristor; stress test; voltage 10 kV; voltage 13.5 kV; Switches; Thyristors; Welding;
Conference_Titel :
Pulsed Power Conference (PPC), 2011 IEEE
Conference_Location :
Chicago, IL
Print_ISBN :
978-1-4577-0629-5
DOI :
10.1109/PPC.2011.6191657
