Title :
Factors influencing the design of microsystems
Author :
Spangler, Leland Chip
Author_Institution :
Aspen Technol., Colorado Springs, CO, USA
Abstract :
The engineering challenges of bringing microsystems products to market are substantially more broad than with conventional microelectronics. Harsh operating conditions and nonstandard materials result in effects not typically of concern for IC designers. Furthermore, supply, process and temperature variations can create significant issues with device performance. This paper provides an overview of microsystem devices and discusses ways some of these effects can be minimized or compensated for.
Keywords :
calibration; compensation; electronics packaging; microactuators; microassembling; microsensors; signal processing equipment; transducers; MEMS; calibration; compensation; electronic actuators; electronic sensors; energy transformation devices; harsh operating conditions; microsystem interface circuits; microsystems design factors; package assembly; packaging; process variations; supply variations; temperature variations; transducer elements; transducers; wafer-based microelectronic fabrication processes; Biological materials; Circuits; Consumer electronics; Fabrication; Mechanical sensors; Microelectronics; Optical materials; Packaging; Temperature sensors; Transducers;
Conference_Titel :
Custom Integrated Circuits Conference, 2004. Proceedings of the IEEE 2004
Print_ISBN :
0-7803-8495-4
DOI :
10.1109/CICC.2004.1358920
