Title :
Verification of drop impact simulations using high-speed camera measurements
Author :
Zaal, J.J.M. ; van Driel, W.D. ; Kessels, F. J H G ; Zhang, G.Q.
Author_Institution :
Delft Univ. of Technol., Delft
Abstract :
The increased use of mobile appliances in today´s society has resulted in an increase of reliability issues related to drop performance. A common method to assess the drop performance is the JEDEC specified drop impact test [1]. In this research the solder loading is investigated by means of drop impact simulations and high-speed camera measurements. The measurements are used to enhance the simulations by tuning the damping parameters. This results in models that are replicating the drop impact amplitudes and are thereby capable of determining the critical solder joint.
Keywords :
cameras; high-speed optical techniques; solders; critical solder joint; damping parameters; drop impact simulations; high-speed camera measurements; solder loading; Cameras; Damping; Frequency; Home appliances; Interferometry; Packaging; Soldering; Strain measurement; Testing; Wafer scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2008.4550283
