• DocumentCode
    1951385
  • Title

    Using high frequency acoustic micro imaging to detect defects in artificial micro void specimens

  • Author

    Tabaru, Marie ; Azuma, Takashi ; Hashiba, Kunio ; Maruyama, Takahisa ; Kenbo, Yukio

  • Author_Institution
    CRT, Tokyo, Japan
  • fYear
    2010
  • fDate
    11-14 Oct. 2010
  • Firstpage
    2388
  • Lastpage
    2391
  • Abstract
    We have studied the acoustic characteristics of echoes reflected from micro void areas. Artificial-defect samples with air gap widths of 30, 50, and 70 μm were developed. Echo signals from the samples were obtained in a pulse-echo experiment with a high-frequency ultrasonic probe (center frequency: 200 MHz). Wave propagation for an artificial-defect model was also simulated by using a finite element method. Calculation and experimental results confirmed that phase shifts and ringing are useful for distinguishing between normal and defective samples. Simulation results show that defect detection is possible for gap widths of less than 10 μm.
  • Keywords
    acoustic imaging; echo; finite element analysis; integrated circuit interconnections; voids (solid); IC chip interconnection; artificial micro void specimen; artificial-defect model; finite element method; high frequency acoustic micro imaging; high-frequency ultrasonic probe; pulse-echo experiment; size 30 mum; size 50 mum; size 70 mum; Acoustic beams; Acoustics; Atmospheric modeling; Copper; Probes; Silicon; Simulation; IC chip; acoustic micro imaging; artificial void; defect detection; flip chip; high-frequency ultrasound;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2010 IEEE
  • Conference_Location
    San Diego, CA
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4577-0382-9
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2010.5935450
  • Filename
    5935450