DocumentCode
1951385
Title
Using high frequency acoustic micro imaging to detect defects in artificial micro void specimens
Author
Tabaru, Marie ; Azuma, Takashi ; Hashiba, Kunio ; Maruyama, Takahisa ; Kenbo, Yukio
Author_Institution
CRT, Tokyo, Japan
fYear
2010
fDate
11-14 Oct. 2010
Firstpage
2388
Lastpage
2391
Abstract
We have studied the acoustic characteristics of echoes reflected from micro void areas. Artificial-defect samples with air gap widths of 30, 50, and 70 μm were developed. Echo signals from the samples were obtained in a pulse-echo experiment with a high-frequency ultrasonic probe (center frequency: 200 MHz). Wave propagation for an artificial-defect model was also simulated by using a finite element method. Calculation and experimental results confirmed that phase shifts and ringing are useful for distinguishing between normal and defective samples. Simulation results show that defect detection is possible for gap widths of less than 10 μm.
Keywords
acoustic imaging; echo; finite element analysis; integrated circuit interconnections; voids (solid); IC chip interconnection; artificial micro void specimen; artificial-defect model; finite element method; high frequency acoustic micro imaging; high-frequency ultrasonic probe; pulse-echo experiment; size 30 mum; size 50 mum; size 70 mum; Acoustic beams; Acoustics; Atmospheric modeling; Copper; Probes; Silicon; Simulation; IC chip; acoustic micro imaging; artificial void; defect detection; flip chip; high-frequency ultrasound;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2010 IEEE
Conference_Location
San Diego, CA
ISSN
1948-5719
Print_ISBN
978-1-4577-0382-9
Type
conf
DOI
10.1109/ULTSYM.2010.5935450
Filename
5935450
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