Title :
Atomistic impurity diffusion simulation of shallow junction fabrication processes and dopant-induced intrinsic fluctuations
Author :
Hane, Masami ; Ikezawa, T.
Author_Institution :
Silicon Syst. Res. Labs., NEC Corp., Sagamihara, Japan
Abstract :
Using a newly developed atomistic dopant diffusion simulator, sophisticated shallow junction fabrication processes, i.e. spike-anneal, flash-lamp anneal, and low temperature anneal, are studied. Based on a kinetic Monte Carlo procedure considering all possible charged species and Fermi-level effects on drift-diffusion and clustering reactions, and incorporating boron diffusion/activation kinetics obtained through ab-initio calculations, this simulator can reproduce various boron spike-anneal experiments without any arbitrary parameter fitting. This atomistic process simulator also enables us to calculate three dimensional dopant atom distribution for actual sub-100 nm MOSFETs. Coupling three-dimensional atomistic process/device simulators, a statistical simulation has been performed to evaluate the intrinsic fluctuation induced by discrete dopant atoms.
Keywords :
CMOS integrated circuits; Fermi level; MOSFET; Monte Carlo methods; ab initio calculations; annealing; boron; diffusion; impurities; semiconductor device models; 100 nm; Fermi level effects; MOSFET; Monte Carlo simulation; ab initio calculations; activation kinetics; annealing; atomistic impurity diffusion; boron diffusion; clustering reaction; discrete dopant atoms; dopant induced intrinsic fluctuations; drift diffusion; shallow junction fabrication; three dimensional dopant atom distribution; Boron; Fabrication; Fluctuations; Impurities; Kinetic theory; MOSFETs; Monte Carlo methods; Performance evaluation; Simulated annealing; Temperature;
Conference_Titel :
Junction Technology, 2002. IWJT. Extended Abstracts of the Third International Workshop on
Conference_Location :
Tokyo, Japan
Print_ISBN :
4-89114-028-3
DOI :
10.1109/IWJT.2002.1225209