DocumentCode :
1951686
Title :
Trends and challenges in lead free soldering
Author :
Lopes, Diogo ; Pinto, Margarida ; Assunção, Eurico ; Coutinho, Luisa
Author_Institution :
Inst. de Soldadura e Qualidade, Oeiras, Portugal
fYear :
2012
fDate :
16-18 April 2012
Firstpage :
42378
Lastpage :
42622
Abstract :
The implementation of new EU environmental directives, the restriction of the use of certain hazardous substances (RoHS) and waste Electrical and Electronic Equipment (WEEE) which involve ban of lead from electronic and electric products and equipments introduced constrains in all the value chain. Soldering new design lead free devices and equipments, testing and comparison with service behaviour and life cycle waste management, introduced a challenge to all the actors and mainly to SMEs. This paper summarizes the work and results developed by ISQ in several in-house and multi-partners projects in the last ten years taking into account the barriers still existing in some industrial sectors and end users, due the reliability and standard proceedings.
Keywords :
electrical products industry; electronics industry; soldering; waste management; EU environmental directives; SME; electric products; electronic products; hazardous substances; lead free devices; lead free soldering; life cycle waste management; service behaviour; value chain; waste electrical equipment; waste electronic equipment; Bismuth; Copper; Lead; Soldering; Tin; Vibrations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on
Conference_Location :
Cascais
Print_ISBN :
978-1-4673-1512-8
Type :
conf
DOI :
10.1109/ESimE.2012.6191697
Filename :
6191697
Link To Document :
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