DocumentCode :
1951713
Title :
An approach to life consumption monitoring of solder joints in operating temperature environment
Author :
Johansson, Jonas ; Belov, Ilja ; Johnson, Erland ; Leisner, Peter
fYear :
2012
fDate :
16-18 April 2012
Firstpage :
42377
Lastpage :
42590
Abstract :
This paper elaborates the 3T-approach to life consumption monitoring of solder joints in operating temperature environment without requiring simplification of operating loads. An overview of the 3T-approach is provided including assumptions made for a proposed realization in an avionic application. Associated implementation routines are highlighted and exemplified for a lead-free PBGA256 package with creep strain energy density (SEDcr) as damage metric. Factors that affect the prediction accuracy are investigated. A data resolution has been determined that delivers response surfaces that provide results comparable to 3-D finite-element (FE) simulations, while bearing two orders of magnitude higher computational efficiency. A stress-free temperature modification routine is proposed and proves to further mitigate accuracy problems.
Keywords :
avionics; condition monitoring; finite element analysis; solders; 3D finite-element simulations; 3T approach; avionic application; creep strain energy density; damage metric; lead-free PBGA256 package; life consumption monitoring; operating temperature environment; solder joints; stress-free temperature modification; Compounds; Hardware; Joints; Lead; Monitoring; Physics; Polymers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on
Conference_Location :
Cascais
Print_ISBN :
978-1-4673-1512-8
Type :
conf
DOI :
10.1109/ESimE.2012.6191699
Filename :
6191699
Link To Document :
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