On composition of mechatronic components enabled by interoperability and portability provisions of IEC 61499: A case study

Author

Patil, Swapnil ; YAN, JIU DUN ; Vyatkin, Valeriy ; Cheng Pang

Author_Institution

Dept. of Electr. & Comput. Syst. Eng., Univ. of Auckland, Auckland, New Zealand

fYear

2013

fDate

10-13 Sept. 2013

Firstpage

1

Lastpage

4

Abstract

Interoperability is one of the most important features expected from distributed automation architectures. Achieving interoperability involves addressing issues related to synchronization of behavior, communication protocols, and data presentation formats. In this paper a case study on deployment of an automation application to a network of control devices with three different hardware/software platforms is presented to exploit benefits of the IEC 61499 architecture. Firstly, an overall control application with essentially distributed logic was created. This control application was then validated using closed-loop simulation and finally deployed to a network of control devices.

Keywords

IEC standards; manipulators; mechatronics; open systems; IEC 61499 architecture; closed-loop simulation; communication protocols; data presentation formats; distributed automation architectures; distributed logic; interoperability provision; mechatronic components; pick-and-place manipulator; portability provision; Hardware; IEC standards; Interoperability; Manipulators; Mechatronics; Semantics; Software; Distributed Control; IEC 61499; Interoperability; Reconfigurable Manufacturing Systems;

fLanguage

English

Publisher

ieee

Conference_Titel

Emerging Technologies & Factory Automation (ETFA), 2013 IEEE 18th Conference on

Conference_Location

Cagliari

ISSN

1946-0740

Print_ISBN

978-1-4799-0862-2

Type

conf

DOI

10.1109/ETFA.2013.6648136

Filename

6648136