DocumentCode
1952262
Title
Analysis of SRAM cell characteristics based on high-k metal-gate strained Si/Si1−x Gex MOSFET with consideration of NBTI/PBTI
Author
Ebrahimi, Behzad ; Afzali-Kusha, Ali
Author_Institution
Nanoelectron. Center of Excellence, Univ. of Tehran, Tehran, Iran
fYear
2012
fDate
19-21 Sept. 2012
Firstpage
137
Lastpage
140
Abstract
In this paper, we investigate the characteristics of SRAM cells with high-k metal-gate Si/Si1-xGex dual channel structures. The characteristics are compared with those of the unstrained structures. The results show that the strain degrades read SNM slightly while increases read current considerably. In addition, it increases writability while decreases standby power. Moreover, NBTI and PBTI effect for two cases of symmetrical and asymmetrical stresses is investigated. In the symmetrical case, read and write stability don´t reduce while read current decreases. For the case of the asymmetrical stress, both read and write stabilities degrade. In addition, read current decreases more than that of the symmetrical case. The results demonstrate while NBTI and PBTI cause less read current reduction in the strained cells, the degradations of other metrics are comparable to those of the unstrained cells.
Keywords
MOSFET; SRAM chips; NBTI; PBTI; SRAM cell characteristics; Si-Si1-xGex; asymmetrical stress; high-k metal-gate strained MOSFET; symmetrical stress; Degradation; Logic gates; Random access memory; Silicon; Strain; Stress; Transistors; NBTI; PBTI; SRAM; high-k; strained silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), 2012 International Conference on
Conference_Location
Seville
Print_ISBN
978-1-4673-0685-0
Type
conf
DOI
10.1109/SMACD.2012.6339436
Filename
6339436
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