In-situ - characterization of moisture induced swelling behaviour of microelectronic relevant polymers

For electronic application many polymer systems such as thermosets and thermoplastics with different properties are widely used. Thermosetting polymers e.g. epoxy resins, cause reliability problems when exposed to humid environments where phenomena such as moisture absorption and diffusion take place. It is important to know both absorption and desorption properties of used polymer systems. This paper presents a newly developed measurement method for analysis of hygroscopic swelling properties of microelectronic relevant polymer systems. A standard measurement thermo mechanical Analyzer was coupled with a conventional humidity generator. TMA is a technique of measuring the dimensional changes of specimens as function of variable temperature. In the humidity and temperature controlled chamber of re-designed TMA-equipment the absorption and/or desorption properties were investigated by measurement of sample dimension change. The moisture uptake in some polymers and the recovery behaviour can be used for verifying of diffusion model. The results can be used for integrated finite element analysis methodology, which couples the transient moisture diffusion and the hygroscopic swelling with temperature range.