• DocumentCode
    1952454
  • Title

    Alternative PEEC Modeling with Partial Reluctances and Capacitances for Power Electronics Applications

  • Author

    Thamm, S. ; Kochetov, S.V. ; Wollenberg, G. ; Leone, M.

  • Author_Institution
    Univ. Magdeburg, Magdeburg
  • fYear
    2007
  • fDate
    26-29 June 2007
  • Firstpage
    56
  • Lastpage
    59
  • Abstract
    Today power electronic design has to account for the interconnection structure. The method of partial elements (PEEC) is a suitable tool to describe arbitrary 3D interconnections. In engineering applications the number of volume and surface cells quickly becomes prohibitively high, due to the huge number of partial inductances and potential coefficients. Therefore, more efficient approaches are needed. It is possible to formulate the couplings in terms of partial reluctances and capacitances as the inverted matrices for the partial inductances and potential coefficients. The advantage of this modeling technique is based on the dominance of the diagonal matrix elements, so that very small values can be ignored under reservation of the passivity of the interconnection structure. Furthermore, one can derive a SPICE compatible circuit without the need for further tools. In this paper a suitable reduction procedure and implementation of the PEEC models with reluctances and capacitances are presented. The accuracy of the simulation results depending on the model reduction is discussed on a typical power electronics application.
  • Keywords
    SPICE; capacitance; matrix inversion; power electronics; 3D interconnection structure; PEEC modeling; SPICE compatible circuit; matrix inversion; model reduction; partial capacitance modeling; partial reluctance modeling; power electronics application design; Capacitance; Circuit simulation; Conducting materials; Coupling circuits; Electromagnetic compatibility; Integrated circuit interconnections; Power electronics; Power engineering and energy; RLC circuits; SPICE;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility and Electromagnetic Ecology, 2007 7th International Symposium on
  • Conference_Location
    Saint-Petersburg
  • Print_ISBN
    978-1-4244-1270-9
  • Electronic_ISBN
    978-1-4244-1270-9
  • Type

    conf

  • DOI
    10.1109/EMCECO.2007.4371645
  • Filename
    4371645