Title :
Thermal improvement of die attach with iodine treatment and its application in solid state lighting
Author :
Zhang, Kai ; Zhang, Xinfeng ; Zhang, Min ; Chen Yang ; Sun, Hongye ; Yuen, Michelle ; Zhong, Barry ; Bok, Aernout Reints ; Liu, Lisa ; Chan, Cheuk Yan ; Zhang, Guoqi
Author_Institution :
Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
Abstract :
The mechanism of thermal conductivity enhancement of silver epoxy based die attach materials (DA) by iodine treatment is studied. Iodine treatment is found to be able to uniform the polymer network and accelerate the curing of die attach at relatively lower temperature with shorter curing duration. In addition, several metal halide salts are proved to have the same effect as the iodine treatment and be able to improve the conductivity of DA. The developed DA is applied in LED packages. The thermal performance of LED packages is evaluated to demonstrate the effect of iodine treatment of DA.
Keywords :
curing; electronics packaging; light emitting diodes; lighting; microassembling; LED packages; curing; die attach materials; iodine treatment; metal halide salts; polymer network; silver epoxy; solid state lighting; thermal conductivity enhancement; thermal improvement; Lead; Light emitting diodes; Lighting; Packaging; Polymers; Thermal conductivity; Voltage control;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on
Conference_Location :
Cascais
Print_ISBN :
978-1-4673-1512-8
DOI :
10.1109/ESimE.2012.6191733
