Title :
Combined creep and fatigue measurement method for lead-free solder alloys
Author :
Metasch, R. ; Roellig, M. ; Wolter, K.-J.
Author_Institution :
Branch Dresden, Fraunhofer Inst. for non-Destruct. Testing, Dresden, Germany
Abstract :
This work studies the secondary creep behaviour at approx. 25% stress drop in the fatigue curve on bulk solder specimens in a tensile and compression experiment. With the adaption of the pre-factor of the secondary creep models the acceleration is describable. To get a good correlation between the model as well as the real tensile and compression experiments, advanced modelling with primary and tertiary creep will be necessary.
Keywords :
creep; fatigue; solders; tensile strength; acceleration; bulk solder specimen; compression experiment; creep measurement; fatigue curve; fatigue measurement; lead-free solder alloy; primary creep; secondary creep behaviour; secondary creep model; stress drop; tensile experiment; tertiary creep; Lead; Stress;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on
Conference_Location :
Cascais
Print_ISBN :
978-1-4673-1512-8
DOI :
10.1109/ESimE.2012.6191735
