Title :
Very high voltage AlGaAs/InGaAs pseudomorphic power HEMTs
Author :
Ming-Yih Kao ; Shih-Tsang Fu ; Pin Ho ; Smith, P.M. ; Chao, P.C. ; Nordheden, K.J. ; Sujane Wang
Author_Institution :
Electron Lab., Gen. Electr. Co., Syracuse, NY, USA
Abstract :
This paper reports the development of double recessed pseudomorphic GaAs High Electron Mobility Transistors (HEMTs) for high voltage operation. The GaAs-based power HEMT with 0.25 mu m gate-length exhibited a gate to drain breakdown voltage of 30 volts, a peak g/sub m/ of 510 mS/mm, and a maximum current density of 540 mA/mm. When biased to 14 volts on the drain, the 400 mu m wide HEMT delivered 505 mW (1.26 W/mm) output power at 4.5 GHz. This is the highest output power density and drain-source operating voltage ever reported for HEMT devices. The device also showed excellent 4.5 and 10 GHz power performance combination (power gain, power density, power-added efficiency) at V/sub ds/=8V. The significant extension of device drain bias range as well as increase in the product of current density and breakdown voltage were attributed to the adoption of channel recess using reactive ion etching.<>
Keywords :
III-V semiconductors; aluminium compounds; gallium arsenide; high electron mobility transistors; indium compounds; power transistors; semiconductor technology; solid-state microwave devices; sputter etching; 0.25 micron; 10 GHz; 14 V; 30 V; 4.5 GHz; 505 mW; 8 V; AlGaAs-InGaAs; breakdown voltage; channel recess; double recessed transistors; drain bias range; drain-source operating voltage; gate to drain breakdown voltage; high voltage operation; maximum current density; output power density; peak transconductance; power density; power gain; power-added efficiency; pseudomorphic power HEMTs; reactive ion etching; Aluminum compounds; Gallium compounds; Indium compounds; MODFETs; Microwave devices; Power transistors; Semiconductor device fabrication; Sputter etching;
Conference_Titel :
Electron Devices Meeting, 1992. IEDM '92. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-0817-4
DOI :
10.1109/IEDM.1992.307369