DocumentCode :
1952653
Title :
A diamond substrate suitable for 5GHz SAW device application
Author :
Fujii, Satoshi ; Jian, Chunyun
Author_Institution :
Acad.-Ind. Collaboration & Intellectual Property, Chiba Univ., Chiba, Japan
fYear :
2010
fDate :
11-14 Oct. 2010
Firstpage :
1669
Lastpage :
1672
Abstract :
SAW characteristics of various layer structures of SiO2/IDT/AlN/diamond substrates that employ 2nd mode of wave (Sezawa mode) were studied both theoretically and experimentally. It was found that the SiO2/IDT/AlN/diamond substrate would allow using thicker metal IDT in SAW device designs than other SAW substrates and also would have zero TCF characteristic at room temperature. SAW phase velocity and electromechanical coupling coefficient of the SiO2/IDT/AlN/diamond substrate are 11150m/s and 0.5%, respectively. Fabricated 1-port SAW resonators using the diamond substrate showed Q of 660 at 5.4 GHz anti-resonance frequency. Frequency drift over temperature range of -25°C to 80°C was about 90 ppm that is even less than the ST-Quartz SAW substrate. In the end of paper, a 5 GHz band stop type SAW filter design is presented. It is shown that 30 MHz wide stopband at 6 dB rejection level can be achieved while keeping the passband insertion loss just in -0.76 dB.
Keywords :
aluminium compounds; band-stop filters; diamond; microwave resonators; silicon compounds; surface acoustic wave resonator filters; surface acoustic wave resonators; SAW device; SAW resonators; Sezawa mode; SiO2-AlN-C; antiresonance frequency; band stop type SAW filter design; diamond substrate; electromechanical coupling coefficient; frequency 30 MHz; frequency 5 GHz; frequency 5.4 GHz; frequency drift; passband insertion loss; quartz SAW substrate; rejection level; room temperature; temperature -25 degC to 80 degC; zero TCF characteristic; Diamond-like carbon; SAW filters; Substrates; Surface acoustic wave devices; Surface acoustic waves; Temperature measurement; band stop filter; diamond SAW substrate; zero TCF;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium (IUS), 2010 IEEE
Conference_Location :
San Diego, CA
ISSN :
1948-5719
Print_ISBN :
978-1-4577-0382-9
Type :
conf
DOI :
10.1109/ULTSYM.2010.5935505
Filename :
5935505
Link To Document :
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