DocumentCode :
1952898
Title :
IC-processed hot-filament vacuum microdevices
Author :
Williams, K.R. ; Muller, R.S.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
fYear :
1992
fDate :
13-16 Dec. 1992
Firstpage :
387
Lastpage :
390
Abstract :
Micromachined vacuum devices that employ a hot tungsten filament as a source of electromagnetic radiation and thermionically emitted electrons have been fabricated. These hot-filament devices have been characterized for use as "microlamps," vacuum diodes, and triodes. Coplanar filaments are used for the cathodes and anodes in the diodes, and also for the grids in the triodes. The filaments are typically 200- mu m long and are suspended over a cavity in the silicon substrate. The devices tested were operated in a pumped vacuum chamber.<>
Keywords :
diodes; elemental semiconductors; semiconductor technology; silicon; triodes; vacuum microelectronics; 200 micron; Si; coplanar filaments; hot-filament vacuum microdevices; microlamps; micromachined vacuum devices; pumped vacuum chamber; silicon substrate; thermionically emitted electrons; vacuum diodes; vacuum triodes; Diodes; Electron tubes; Semiconductor device fabrication; Silicon; Vacuum microelectronics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1992. IEDM '92. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-0817-4
Type :
conf
DOI :
10.1109/IEDM.1992.307384
Filename :
307384
Link To Document :
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