Thermal resistance investigations on new leadframe-based LED packages and boards

Author

Pardo, B. ; Gasse, A. ; Fargeix, A. ; Jakovenko, J. ; Werkhoven, R.J. ; Perpiña, X. ; Van Weelden, T. ; Bancken, P.

Author_Institution

CEA-Leti, MINATEC Campus, Grenoble, France

fYear

2012

fDate

16-18 April 2012

Firstpage

42378

Lastpage

42622

Abstract

In Solid State Lighting, thermal management is a key issue. Within the C-SSL consortium, we have developed an advanced leadframe based package to reduce the thermal resistance of the component. Numerical simulations have been implemented using Ansys^® software and thermal measurements have been carried out using the forward voltage method to derive the thermal resistance. The T3ster^® transient thermal analysis has been used to determine the different thermal resistance contributions in the package and in the board showing good correlation between experimental and simulation results. Low thermal resistances of 5.5 K/W have been obtained on our advanced leadframe based package and have been compared with standard Rebel LEDs on board.

Keywords

electronics packaging; light emitting diodes; temperature measurement; thermal management (packaging); thermal resistance; transient analysis; Ansys software; C-SSL consortium; T3ster transient thermal analysis; advanced leadframe based package; forward voltage method; leadframe-based LED boards; leadframe-based LED packages; numerical simulations; solid state lighting; standard Rebel LEDs on board; thermal management; thermal measurements; thermal resistance contributions; thermal resistance investigations; Cooling; Films; Heating; Lead; Nonhomogeneous media; RNA;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on

Conference_Location

Cascais

Print_ISBN

978-1-4673-1512-8

Type

conf

DOI

10.1109/ESimE.2012.6191750

Filename

6191750