DocumentCode
1953021
Title
Self-heating in high performance bipolar transistors fabricated on SOI substrates
Author
Ganci, P.R. ; Hajjar, J.-J.J. ; Clark, T. ; Humphries, P. ; Lapham, J. ; Buss, D.
Author_Institution
Semicond. Div., Analog Devices Inc., Wilmington, MA, USA
fYear
1992
fDate
13-16 Dec. 1992
Firstpage
417
Lastpage
420
Abstract
The effects of self-heating on the characteristics of bipolar transistors fabricated on silicon-on-insulator (SOI) substrates are discussed through measurements and simulations. It is shown that the SOI substrate´s buried oxide affects the thermal characteristics of the transistor. A three fold increase in thermal resistivity is observed on transistors fabricated on SOI substrates over identical transistors fabricated on regular silicon substrates. Moreover, thermal gradients within the device footprint are also discussed and evaluated both experimentally and using MEDICI simulations. Finally, a simple thermal model is presented which predicts transistor characteristics with good accuracy.<>
Keywords
SPICE; bipolar transistors; digital simulation; semiconductor device models; semiconductor-insulator boundaries; MEDICI simulations; SOI substrates; buried oxide; device footprint; high performance bipolar transistor; self-heating; thermal characteristics; thermal gradients; thermal model; thermal resistivity; transistor characteristics; Bipolar transistors; SPICE; Semiconductor device modeling; Semiconductor-insulator interfaces; Simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1992. IEDM '92. Technical Digest., International
Conference_Location
San Francisco, CA, USA
ISSN
0163-1918
Print_ISBN
0-7803-0817-4
Type
conf
DOI
10.1109/IEDM.1992.307391
Filename
307391
Link To Document