• DocumentCode
    1953021
  • Title

    Self-heating in high performance bipolar transistors fabricated on SOI substrates

  • Author

    Ganci, P.R. ; Hajjar, J.-J.J. ; Clark, T. ; Humphries, P. ; Lapham, J. ; Buss, D.

  • Author_Institution
    Semicond. Div., Analog Devices Inc., Wilmington, MA, USA
  • fYear
    1992
  • fDate
    13-16 Dec. 1992
  • Firstpage
    417
  • Lastpage
    420
  • Abstract
    The effects of self-heating on the characteristics of bipolar transistors fabricated on silicon-on-insulator (SOI) substrates are discussed through measurements and simulations. It is shown that the SOI substrate´s buried oxide affects the thermal characteristics of the transistor. A three fold increase in thermal resistivity is observed on transistors fabricated on SOI substrates over identical transistors fabricated on regular silicon substrates. Moreover, thermal gradients within the device footprint are also discussed and evaluated both experimentally and using MEDICI simulations. Finally, a simple thermal model is presented which predicts transistor characteristics with good accuracy.<>
  • Keywords
    SPICE; bipolar transistors; digital simulation; semiconductor device models; semiconductor-insulator boundaries; MEDICI simulations; SOI substrates; buried oxide; device footprint; high performance bipolar transistor; self-heating; thermal characteristics; thermal gradients; thermal model; thermal resistivity; transistor characteristics; Bipolar transistors; SPICE; Semiconductor device modeling; Semiconductor-insulator interfaces; Simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1992. IEDM '92. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-0817-4
  • Type

    conf

  • DOI
    10.1109/IEDM.1992.307391
  • Filename
    307391