• DocumentCode
    1953065
  • Title

    The design concept of system integration based on heterostructure

  • Author

    Slosar ík, Stanislav ; Cabúk, Pavol ; Kalita, Wlodzimierz ; Bauer, Reinhard ; Sabat, Wieslaw ; Kardo, Slavomír

  • Author_Institution
    Dept. of Technol. in Electron., Tech. Univ. of Kosice, Košice, Slovakia
  • fYear
    2011
  • fDate
    11-15 May 2011
  • Firstpage
    17
  • Lastpage
    21
  • Abstract
    This study shows technological realization of heterostructure LTCC structure - HTCC substrate. Heterostructure realization results are analyzed regarding the application of LTCC ceramics and HTCC substrates where possible solution is local heat dissipation from power elements. Technological solution has been applied during the 3D integrations of mobile mini-machine control electronics in a System on Module (SoM) assembly.
  • Keywords
    ceramic packaging; cooling; HTCC substrate; LTCC ceramics; SoM assembly; heat dissipation; heterostructure LTCC structure; mobile minimachine control electronics; system on module; Aluminum oxide; Heating; Lamination; Mobile communication; Substrates; Temperature measurement; Three dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), 2011 34th International Spring Seminar on
  • Conference_Location
    Tratanska Lomnica
  • ISSN
    2161-2528
  • Print_ISBN
    978-1-4577-2111-3
  • Type

    conf

  • DOI
    10.1109/ISSE.2011.6053542
  • Filename
    6053542
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1953065