Title :
Test of wettability of lead-free solders
Author :
Podzemský, JiYí ; Urbánek, Jan
Author_Institution :
Fac. of Electr. Eng., Czech Tech. Univ., Prague, Czech Republic
Abstract :
This paper deals with wettability of widely used lead-free solders. Tested solders were lead-free solders Sn-3,8Ag-0,7Cu, Sn-4Ag, Sn-1Cu and Pb containing solder Sn-37Pb. Wetting balance method was used for testing wettability of the solders mentioned above according to standard ČSN EN 60068-2-54. Temperature of melted solder was 235°C for Sn-37Pb and 248°C for lead-free solders. Wetting was tested for copper and nickel in form of wire with diameter 1 mm and length 20 mm. Samples were dipped into melted solder and total force actuating in time during the test was measured. Key parameters for characterization wetting behavior of solder were maximum wetting force and the time to reach 2/3 of that force. The influence of nitrogen atmosphere was tested as well.
Keywords :
copper alloys; lead; materials testing; nickel; silver alloys; solders; tin alloys; wetting; CSN EN 60068-2-54; Ni; Pb; Sn-Ag-Cu; lead-free solders; size 1 mm; size 20 mm; temperature 235 C; temperature 248 C; wettability test; wetting balance method; Atmosphere; Atmospheric measurements; Copper; Force; Lead; Manganese; Nitrogen;
Conference_Titel :
Electronics Technology (ISSE), 2011 34th International Spring Seminar on
Conference_Location :
Tratanska Lomnica
Print_ISBN :
978-1-4577-2111-3
DOI :
10.1109/ISSE.2011.6053549
