Thermal management of embedded devices

The presented work analyses the influences that different materials, component placements and other factors have on the efficiency of heat dissipation from the main processing unit of embedded devices. Passive cooling methods are investigated, since these not only require the least space, but also have no need to be powered. It has been shown, with the aid of simulations implemented in SolidWorks, that these devices can be efficiently cooled by an optimal selection of manufacturing materials and using the constructive elements of these devices, such as the EMC shield to draw away heat from components.