Title :
Advanced electro-thermal SPICE modeling of large power IGBTs
Author :
Azar, R. ; Udrea, F. ; Ng, W.T. ; Dawson, F. ; Findlay, W. ; Waind, P. ; Amaratunga, G.
Author_Institution :
Dept. of Eng., Cambridge Univ., UK
Abstract :
A novel IGBT electro-thermal model is implemented for the first time in PSpice for the simulation of steady state and transient temperature dependent IGBT operation including self-heating and latchup. A thermal circuit representing the characteristics of the IGBT package is developed and validated against a finite element model and experimental results. A novel electrical IGBT model based on the Kraus model is developed to account for the electrical impact of instantaneous junction temperature variations due to self-heating. The resulting electro-thermal model is validated against experimental dc and transient FBSOA measurements.
Keywords :
SPICE; circuit CAD; circuit simulation; insulated gate bipolar transistors; temperature measurement; transient analysis; IGBT electro-thermal model; IGBT operation; IGBT package characteristic; Kraus model; electro-thermal SPICE modeling; experimental dc measurements; finite element model; junction temperature variation; large power IGBT; latchup; self-heating; steady state simulation; thermal circuit; transient FBSOA measurements; transient temperature dependent; Coupling circuits; Finite element methods; Immune system; Insulated gate bipolar transistors; Power engineering and energy; SPICE; Semiconductor device packaging; Steady-state; Temperature dependence; Thermal resistance;
Conference_Titel :
Power Semiconductor Devices and ICs, 2003. Proceedings. ISPSD '03. 2003 IEEE 15th International Symposium on
Print_ISBN :
0-7803-7876-8
DOI :
10.1109/ISPSD.2003.1225285
