• DocumentCode
    1953271
  • Title

    Boundary value of rheological properties of solder paste

  • Author

    Pietriková, Alena ; Krav ík, Michal

  • Author_Institution
    Dept. of Technol. in Electron., Tech. Univ. of Kosice, Kosice, Slovakia
  • fYear
    2011
  • fDate
    11-15 May 2011
  • Firstpage
    94
  • Lastpage
    97
  • Abstract
    This work has been focused on viscosity and rheological measurement of some solder pastes as non-Newtonian. The results of the analysis show that increasing amount of metal powder content in solder paste show on influences of rheology changes of the solder paste. It is known that viscosity increases with increasing metal content. Aim of this work was determination of boundary value of viscosity and rheological properties without losses of thixotropy and pseudo plastic character. This typical feature of non-Newton liquid is important for better understanding of philosophy for high quality of solder paste deposition. Significant differences between the results were observed, which demonstrate the importance of measuring thixotropy and non-recovery rate R of non- Newtonian properties for realistic representation of the flow behaviours of solder paste.
  • Keywords
    powders; rheology; solders; thixotropy; viscosity; boundary value; flow behaviour representation; metal powder content; nonNewton liquid; pseudo plastic character; rheological measurement; solder paste deposition; thixotropy measurement; viscosity; Apertures; Blades; Metals; Powders; Printing; Rheology; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), 2011 34th International Spring Seminar on
  • Conference_Location
    Tratanska Lomnica
  • ISSN
    2161-2528
  • Print_ISBN
    978-1-4577-2111-3
  • Type

    conf

  • DOI
    10.1109/ISSE.2011.6053557
  • Filename
    6053557