DocumentCode
1953271
Title
Boundary value of rheological properties of solder paste
Author
Pietriková, Alena ; Krav ík, Michal
Author_Institution
Dept. of Technol. in Electron., Tech. Univ. of Kosice, Kosice, Slovakia
fYear
2011
fDate
11-15 May 2011
Firstpage
94
Lastpage
97
Abstract
This work has been focused on viscosity and rheological measurement of some solder pastes as non-Newtonian. The results of the analysis show that increasing amount of metal powder content in solder paste show on influences of rheology changes of the solder paste. It is known that viscosity increases with increasing metal content. Aim of this work was determination of boundary value of viscosity and rheological properties without losses of thixotropy and pseudo plastic character. This typical feature of non-Newton liquid is important for better understanding of philosophy for high quality of solder paste deposition. Significant differences between the results were observed, which demonstrate the importance of measuring thixotropy and non-recovery rate R of non- Newtonian properties for realistic representation of the flow behaviours of solder paste.
Keywords
powders; rheology; solders; thixotropy; viscosity; boundary value; flow behaviour representation; metal powder content; nonNewton liquid; pseudo plastic character; rheological measurement; solder paste deposition; thixotropy measurement; viscosity; Apertures; Blades; Metals; Powders; Printing; Rheology; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology (ISSE), 2011 34th International Spring Seminar on
Conference_Location
Tratanska Lomnica
ISSN
2161-2528
Print_ISBN
978-1-4577-2111-3
Type
conf
DOI
10.1109/ISSE.2011.6053557
Filename
6053557
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