DocumentCode
1953331
Title
A domain decomposition method for the simulation of fracture in polysilicon MEMS
Author
Confalonieri, Federica ; Cocchetti, Giuseppe ; Ghisi, Aldo ; Corigliano, Alberto
Author_Institution
Dept. of Struct. Eng., Politec. di Milano, Milan, Italy
fYear
2012
fDate
16-18 April 2012
Firstpage
42377
Lastpage
42590
Abstract
In this paper, a domain decomposition approach is proposed to efficiently address the finite element simulation of fracture phenomena in polysilicon MEMS under impact dynamics. The analysis is performed at the microscale, i.e. at the level of the microstructural parts composing the microsystem, in order to simulate local failure mechanisms developing in critical regions.
Keywords
elemental semiconductors; failure analysis; finite element analysis; fracture; micromechanical devices; silicon; Si; domain decomposition method; finite element simulation; fracture phenomena; fracture simulation; impact dynamics; local failure mechanism; microstructural part; microsystem; polysilicon MEMS; Computational modeling; Computers; Micromechanical devices; Numerical models;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on
Conference_Location
Cascais
Print_ISBN
978-1-4673-1512-8
Type
conf
DOI
10.1109/ESimE.2012.6191769
Filename
6191769
Link To Document