3D structure with opened cavities in low shrinkage LTCC

Author

Stekovic, Michal ; Sandera, Josef

Author_Institution

Dept. of Microelectron., Brno Univ. of Technol., Brno, Czech Republic

fYear

2013

fDate

8-12 May 2013

Firstpage

74

Lastpage

78

Abstract

This paper is focused on design and fabrication of a three-dimensional (3D) structured module with opened cavities in Low Temperature Co-fired Ceramic (LTCC) substrate. The structure is built up by the uniaxial thermo-compression lamination. This process is one of the simplest, but it brings up some limitations for structure creating. It was also investigated effect of the pseudo-isostatic lamination. The Heraeus Heralock™ 2000 substrate with near zero shrinkage was used. The research goal is to find an optimal method of 3D structure with opened cavities production by means of error limiting and increasing reproducibility.

Keywords

ceramic packaging; laminations; shrinkage; Heraeus Heralock 2000 substrate; low shrinkage LTCC; low temperature co-fired ceramic substrate; near zero shrinkage; opened cavities; optimal method; pseudoisostatic lamination; three-dimensional structured module; uniaxial thermo-compression lamination; Cavity resonators; Ceramics; Firing; Lamination; Manufacturing processes; Substrates; Three-dimensional displays;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology (ISSE), 2013 36th International Spring Seminar on

Conference_Location

Alba Iulia

ISSN

2161-2528

Type

conf

DOI

10.1109/ISSE.2013.6648218

Filename

6648218