Title :
Electrical characterization of signal routability and performance [CPGAs]
Author :
Mechaik, Mehdi M.
Author_Institution :
Comput. Aided Eng. & PCB Design, Cisco Syst., San Jose, CA, USA
Abstract :
Electrical characterization and performance of signal routing layers is analyzed for ceramic pin grid array (CPGA) packages. Numerical values are tabulated for crosstalk, and attenuation for signal The implications of layer routability, signal width, and signal thickness are also analyzed. A table of numerical values for the differential impedance of a dual microstrip line is also obtained
Keywords :
ceramic packaging; crosstalk; integrated circuit packaging; microstrip lines; network routing; CPGA packages; ceramic pin grid array; crosstalk; differential impedance; dual microstrip line; electrical characterization; layer routability; signal routability; signal thickness; signal width; Ceramics; Distributed parameter circuits; Frequency; Inductance; Integrated circuit interconnections; Microprocessors; Packaging; Power transmission lines; Routing; Signal analysis;
Conference_Titel :
Quality Electronic Design, 2000. ISQED 2000. Proceedings. IEEE 2000 First International Symposium on
Conference_Location :
San Jose, CA
Print_ISBN :
0-7695-0525-2
DOI :
10.1109/ISQED.2000.838892
