DocumentCode
1953386
Title
Electrical characterization of signal routability and performance [CPGAs]
Author
Mechaik, Mehdi M.
Author_Institution
Comput. Aided Eng. & PCB Design, Cisco Syst., San Jose, CA, USA
fYear
2000
fDate
2000
Firstpage
329
Lastpage
336
Abstract
Electrical characterization and performance of signal routing layers is analyzed for ceramic pin grid array (CPGA) packages. Numerical values are tabulated for crosstalk, and attenuation for signal The implications of layer routability, signal width, and signal thickness are also analyzed. A table of numerical values for the differential impedance of a dual microstrip line is also obtained
Keywords
ceramic packaging; crosstalk; integrated circuit packaging; microstrip lines; network routing; CPGA packages; ceramic pin grid array; crosstalk; differential impedance; dual microstrip line; electrical characterization; layer routability; signal routability; signal thickness; signal width; Ceramics; Distributed parameter circuits; Frequency; Inductance; Integrated circuit interconnections; Microprocessors; Packaging; Power transmission lines; Routing; Signal analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design, 2000. ISQED 2000. Proceedings. IEEE 2000 First International Symposium on
Conference_Location
San Jose, CA
Print_ISBN
0-7695-0525-2
Type
conf
DOI
10.1109/ISQED.2000.838892
Filename
838892
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