DocumentCode :
1953418
Title :
In-situ moisture desorption characterization of epoxy mold compound
Author :
Fan, Xuejun ; Nagaraj, Vishal
Author_Institution :
Dept. of Mech. Eng., Lamar Univ., Beaumont, TX, USA
fYear :
2012
fDate :
16-18 April 2012
Firstpage :
42375
Lastpage :
42527
Abstract :
Moisture desorption characteristics of an epoxy mold compound (EMC) at 100°C, 120°C, 140°C, 160°C, 180°C, 200°C, 220°C, 240°C, and 260°C, respectively, is studied in this paper. A high resolution moisture analyzer is used to measure in-situ moisture weight loss as a function of time at different temperatures. The specimens are preconditioned (e.g. 85°C /85%RH) before they are placed in the analyzer for desorption process. The material can be heated to the desired temperature in a contained septum bottle that connects to a dry air flow system and a moisture sensor. The moisture sensor detects water in the gas stream to generate an accurate measurement of the moisture content released from the specimen. Manual moisture weight gain tests at 85°C/85% RH and 60°C/85% RH are also performed for comparison analysis. It is found that while dual stage model describes the anomalous moisture absorption and desorption well at temperatures below 100°C, a single-phase Fickian diffusion model fit the desorption curves reasonably above 100°C. This means that the initial moisture content, which includes both free and bound water, can be released completely at higher temperatures in reflow process. Arrhenius constants, i.e. pre-factor and activation energy, are obtained for an entire temperature range both below and above the glass transition temperature.
Keywords :
diffusion; moisture measurement; moulding; resins; Arrhenius constants; air flow system; desorption curves; epoxy mold compound; gas stream; high resolution moisture analyzer; in-situ moisture desorption characterization; moisture sensor; single-phase Fickian diffusion model; temperature 100 C; temperature 120 C; temperature 140 C; temperature 160 C; temperature 180 C; temperature 200 C; temperature 220 C; temperature 240 C; temperature 260 C; Absorption; Equations; Loss measurement; Materials; Moisture measurement; Temperature measurement; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on
Conference_Location :
Cascais
Print_ISBN :
978-1-4673-1512-8
Type :
conf
DOI :
10.1109/ESimE.2012.6191772
Filename :
6191772
Link To Document :
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