Title :
Multi-physics simulation and reliability analysis for LED luminaires under step stress accelerated degradation test
Author :
Tang, Hongyu ; Yang, D.G. ; Zhang, G.Q. ; Hou, Fengze ; Cai, Miao ; Zaifu Cui
Author_Institution :
Guangxi Key Lab. of Manuf. Syst. & Adv. Manuf. Technol., Guilin Univ. of Electron. Technol., Guilin, China
Abstract :
In this paper, the 3D model of a LED luminaire is built using the software Pro/Engineer and then the model is transferred to ANSYS Workbench platform where the LED luminaire under the temperature and humidity conditions during step stress accelerated degradation test (SSADT) is simulated. The simulation results of temperature distribution, humidity distribution and stress distribution of the model at three levels of temperature (45°C, 65°C, 85°C) and 60% RH (Relative Humidity) are acquired using multi-physics approach. In the post-processing of temperature data, combining Yamaoshi?s optical power empirial formula of LED degradation with the junction temperature in simulation, the optical decay curves at each stage of the test are obtained. Then, the long-term life test (LTLT) at room temperature (25°C) and SSADT at three levels of temperature are performed to illustrate the validity of simulation. The lumen maintenance of 3 LED luminaires by LTLT and 5 samples by SSADT are analyzed to evaluate the luminous flux, optical decay rate and reliability under different working and ambient conditions. Finally, a comparison is made between the results of experiment and simulation. It is shown that the simulation results agree well with optical decay curves from the test, which indicates that the method can be used to predict the optical decay of LED luminaires.
Keywords :
light emitting diodes; reliability; 3D model; ANSYS workbench platform; LED degradation; LED luminaires; humidity condition; humidity distribution; junction temperature; long-term life test; lumen maintenance; luminous flux; multiphysics simulation; optical decay curves; optical decay rate; optical power empirial formula; relative humidity; reliability analysis; room temperature; software Pro/Engineer; step stress accelerated degradation test; stress distribution; temperature 25 C; temperature 45 C; temperature 65 C; temperature 85 C; temperature data; temperature distribution; Electronic packaging thermal management; Gallium nitride; Light emitting diodes; Moisture; Thermal analysis; Thermal conductivity; Thermal expansion;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on
Conference_Location :
Cascais
Print_ISBN :
978-1-4673-1512-8
DOI :
10.1109/ESimE.2012.6191774