Title :
MID in the automotive industry-potentials, benefits and applications
Author :
Feldmann, Klaus ; Pöhlau, Frank
Author_Institution :
Erlangen-Nurnberg Univ., Germany
Abstract :
Molded interconnect device (MID) technology integrates electrical and mechanical functions into a single molded part. A variety of methods is available for manufacturing MIDs. Depending on the application, the use of MID technology allows more than 20% in cost savings over conventional technologies, as proven by several examples. MIDs boast a wide field of applications in an automobile and have been sucessfully used in several cases
Keywords :
automotive electronics; integrated circuit interconnections; integrated circuit packaging; moulding; plastic packaging; MID manufacturing; MID technology; automobile applications; automotive industry; cost savings; electrical/mechanical function integration; molded interconnect device technology; single molded part; Assembly; Automobiles; Automotive engineering; Circuits; Consumer electronics; Costs; Electrical products industry; Instruments; Labeling; Manufacturing;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1998. IEMT-Europe 1998. Twenty-Second IEEE/CPMT International
Conference_Location :
Berlin
Print_ISBN :
0-7803-4520-7
DOI :
10.1109/IEMTE.1998.723063
