DocumentCode :
1953607
Title :
Simulation and qualification of a system-in-package (SiP) based solid state lighting (SSL) module
Author :
Farley, D.M. ; Boschman, F. ; Bullema, J.E. ; Gielen, A.W.J. ; Hesen, P. ; Krugers, J.P.H.M. ; Swartjes, F. ; van Zeijl, H. ; Zhang, G.Q.
fYear :
2012
fDate :
16-18 April 2012
Firstpage :
42372
Lastpage :
42432
Abstract :
The reliability assessment aspect of the LED field is not fully developed. The lack of complete understanding is due, in part, to the newness of the field. SSL has not existed long enough to directly gauge the accuracy of the Lifetime Assessments being made. The approach of using simulation in qualification to Lifetime Assessment is one of the major techniques used in the electronics field, in general. This methodology uses a complex approach of characterization, testing, and mathematical simulation to produce what some say is the best route for electronics reliability assessment. At present, literature surveys produce only a few papers implementing any simulation approach to SSL technology reliability assessment.
Keywords :
light emitting diodes; lighting; semiconductor device reliability; system-in-package; LED field; SSL module; SSL technology reliability assessment; SiP; electronics field; electronics reliability assessment; lifetime assessments; reliability assessment aspect; solid state lighting module; system-in-package; Analytical models; Lead; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on
Conference_Location :
Cascais
Print_ISBN :
978-1-4673-1512-8
Type :
conf
DOI :
10.1109/ESimE.2012.6191780
Filename :
6191780
Link To Document :
بازگشت